Teck Joo Goh
Business Transaction Advisor
Business Transaction Advisor
Phone: 925 201 1989
Mobile: 408 863 2986
Email: teck.goh@Linkbusiness.com
Office: Silicon Valley
Teck Joo Goh is a M&A Advisor at LINK Silicon Valley, specializing in complex M&A transactions across AI, Data, Security, and Semiconductor industries. Drawing from his 28-year executive career at Intel Corporation, he brings comprehensive expertise spanning the complete technology stack – from semiconductor hardware to AI software solutions.
In AI and Data technologies, Teck recently led Intel’s Global AI Software and Cloud Services Ecosystem & Partnerships, where he built strategic alliances with industry leaders in AI, analytics, and enterprise data platforms. His proven track record in scaling partner ecosystems and deep understanding of AI/ML platforms positions him uniquely to evaluate strategic opportunities in this rapidly evolving sector.
His Security and Cloud Infrastructure experience includes spearheading Intel’s security software portfolio transformation, with emphasis on Trust and Security solutions and Cloud Infrastructure/Platform as a Service (I/PaaS). Through strategic partnerships with Cloud Service Providers, System Integrators, and Independent Software Vendors, he demonstrates exceptional ability in navigating complex technology ecosystems.
In the Semiconductor domain, Teck’s expertise encompasses the entire value chain from silicon to systems. As leader of Intel’s Advanced Silicon Packaging, Board, and System groups across Asia and the US, he directed technology development and product management, delivering innovative computing system designs that resulted in multiple U.S. patents.
His past leadership roles in product and innovation groups focused on identifying key growth areas and strategic pathfinding, providing him with valuable insights into both startup and enterprise perspectives. This comprehensive understanding enables him to create win-win opportunities in technology-focused M&A transactions.
Teck holds a PhD in Mechanical Engineering and an MBA from the University of Southern California. His accomplishments include multiple U.S. patents and over 40 peer-reviewed publications in microelectronics packaging and advanced computing technologies. Quadrilingual in English, Mandarin, Malay, and Bahasa Indonesia, he brings valuable global perspective to cross-border transactions. His balanced expertise across AI, Data, Security, and Semiconductor sectors makes him an ideal advisor for companies seeking strategic exits or acquisitions in the technology sector.